Joe FjelstadColumnist

Joseph Fjelstad is a 34-year veteran of the electronics inter-connection industry and international authority, author, columnist, lecturer and innovator with more than 150 issued and pending US patents in the field. He is co-founder and CEO of SiliconPipe, a leader in high speed interconnection architecture design, much of it, not surprisingly, based on flexible circuit technology. Prior to founding SiliconPipe, he was with IC package technology developer Tessera Technologies, where he was appointed the company’s first fellow.

http://pcb.iconnect007.com/radio/joe.htm

Verdant Electronics is a privately held company dedicated to the development and deployment of sustainable manufacturing technologies and techniques for use in the production of electronic products that will reduce manufacturing  process time, material waste and energy use, thereby reducing costs and reducing the impact of electronic product manufacture on the environment.

About the Founder

Verdant Electronics founder and President Joseph (Joe) Fjelstad has more than 35 years of international experience in electronic interconnection and packaging technology in a variety of capacities from chemist to process engineer and from international consultant to CEO. Mr. Fjelstad is also a well known author and magazine columnist writing on the subject of electronic interconnection technologies. Prior to founding Verdant, Mr. Fjelstad co-founded SiliconPipe a leader in the development of high speed interconnection technologies. He was also formerly with Tessera Technologies, a global leader in chip-scale packaging, where he was appointed to the first corporate fellowship for his innovations.

Here is the long version…
Verdant Electronics founder and President Joseph (Joe) Fjelstad has more than 35 years of international experience in electronic interconnection and packaging technology. Prior to founding Verdant, Mr. Fjelstad co-founded SiliconPipe a leader in high speed interconnection technology. He was also formerly with Tessera Technologies, a global leader in chip-scale packaging, where he was appointed to the first corporate fellowship for his innovations. With a background in chemistry, Mr. Fjelstad has served in a variety of capacities over his career, including analytical chemist, manufacturing chemist, process engineer, quality manager, R&D manager and international consultant. As an inventor, his innovations for electronic interconnection products, medical devices, processes and consumer items have thus far yielded more than 150 issued or pending US patents and numerous foreign patent awards. Mr. Fjelstad is a prodigious communicator as author, coauthor and editor of several books on electronic interconnection technologies and having also written more than 250 articles and commentaries on electronics. He is also an advisor to Advanced Packaging magazine and Circuit World journal and a monthly columnist for Circuitree and Global SMT & Packaging magazines and frequent audio commentator for Iconnect007.com. He is a recipient of several industry awards, including the IPC President’s Award for his contributions to the IPC and electronics industries. During 2000, Mr. Fjelstad was also recognized as one of the most influential persons in the printed-circuit industry in a survey sponsored by Printed Circuit Design and Fabrication and magazine. He is a senior member of the IEEE, the SMTA and MEPTEC and remains active in the IPC and its projects as a member of the National Electronics Roadmap Committee, JNAC and the JISSO International Committee.

“Verdant Electronics has scored a winner by presenting the world with a profoundly new way circuits and assembly are made. The Occam Process is a true innovation that’s going to be big.”
Martin Hart, Mirror Semiconductor