TRI redefines high speed inspection at NEPCON South China 2017

Test Research, Inc. (TRI) will feature a new generation of high performance SPI, AOI, AXI and ICT inspection solutions focusing at NEPCON South China 2017 exhibition. Visit us at booth 1E65 in Hall 1 of Shenzhen Convention & Exhibition Center from August 29 ~ August 31, 2017 for a personal tour of the latest developments in TRI’s award winning solutions for Industry 4.0 PCBA inspection.
TRI’s new 2017 lineup introduces the TR7600 SIII 3D CT X-ray inspection, which brings together exceptional imaging quality, ultra-high performance and smart inspection software in the industry’s most advanced 3D AXI solution.

The TR7500QE stop-and-go 3D AOI system is designed for best inspection coverage with maximum accuracy with 2D+3D clear image and accurate 3D solder inspection. Now featuring CoaXPress for industry leading inspection performance.

The full lineup is joined by TR7007Q – high accuracy 3D SPI designed for industry’s smallest SMT components, and completed by TRI’s award-winning ICT solution TR5001D SII INLINE, which features latest parallel testing technology and almost unlimited expandability.

Discover how TRI’s complete range of PCBA test solutions works together to bring you maximum value in production line and minimize production costs. All TRI solutions are designed to interoperate with other manufacturing equipment; by integrating with YMS 4.0 yield management solution and Industry 4.0-based productions, they can help to minimize down times, optimize production quality and reduce operator work load. Visit us at booth 1E65 in hall 1 for a personal tour of TRI’s solution lineup.

http://www.tri.com.tw