Global Selective Soldering Equipment Market 2017-2021

The analysts forecast the global selective soldering equipment market to grow at a CAGR of 5.53% during the period 2017-2021.

The report covers the present scenario and the growth prospects of the global selective soldering equipment market for 2017-2021. To calculate the market size, the report considers the demand for cartridge seals from various end-user industries.

The report, Global Selective Soldering Equipment Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the Key vendors operating in this market.

For more information please click on:
https://www.researchandmarkets.com/publication/my91vho/4319189

Key vendors
– Kurtz Ersa
– Pillarhouse
– RPS Automation
– SEHO Systems
– Vitronics Soltec

Other prominent vendors
– ACE Production Technologies
– Blundell Production Equipment
– EBSO Manncorp
– JUKI Automation
– Manncorp
– Nordson Corporation
– SMTnet

You can request one free hour of the analyst’s time when you purchase this market report. Details are provided within the report.

For more information please click on:
https://www.researchandmarkets.com/publication/my91vho/4319189

Commenting on the report, an analyst from the research team said: “One trend in the market is short product life cycle of electronic devices. Rapid technology changes and constant upgradations have reduced the life cycle of electronic products. This has put immense pressure on OEMs to manufacture new products with reduced lead time to meet market demands.”

According to the report, one driver in the market is HDI technology driving the PCB market. High density interconnect (HDI) technology is acting as a major driver of the PCB market. With the growing trend of compact devices, there is an increasing need for faster data transfer, thinner packaging along with low power consumption. This gives rise to the miniaturization of electronic components, resulting in high circuit density that leads to a complex interconnection between components. This is because the overall pin counts along with the pitches (space between two pins) shrink, in turn posing a challenge for PCB manufacturers to produce boards that meet these criteria.

Further, the report states that one challenge in the market is intense competition. Because of rapid technological advancements and evolving industry standards, vendors in the selective soldering equipment market need to anticipate changes in technology and introduce new products incorporating new standards and technologies. This decision to comply with rapidly changing technology proves to be a capital-intensive as well as time-consuming process. All these factors require more investment in production processes as vendors have to design and develop products quicker than their competitors to remain competitive in the market.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.

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